Molded Interconnect Device (MID) - Global Strategic Business Report 2026 | Secure Share as Market Surges 141% to $5.3B by 2032; Benchmark Amphenol, HARTING, KYOCERA, Molex and TE Connectivity

Miniaturization, lower assembly costs and design flexibility fuel MID adoption across automotive, consumer electronics and healthcareDublin, Oct. 21, 2026 (GLOBE NEWSWIRE) -- "Molded Interconnect Device (MID) - Global Strategic Business Report" has been added to ResearchAndMarkets.com's offering. The global Molded Interconnect Device (MID) market was valued at US$2.2 billion in 2025 and is projected to reach US$5.3 billion by 2032, expanding at a compound annual growth rate (CAGR) of 13.1% durin